Design and Finite Element Analysis of Prefabricated Waffle Slabs for Electronic Chip Manufacturing Plants
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摘要: 依托上海某电子芯片厂房项目,提出了一种整体装配式华夫板结构。通过有限元建模,计算叠合板拼缝深度和活载质量对楼板自振频率、刚度、原位频响函数的影响。随着叠合板拼缝深度的增加,华夫板同阶自振频率、刚度降低,楼盖振动响应增大,且叠合板拼缝深度越大,各个指标变化越快。当叠合板深度在100 mm以内时,华夫板动刚度、频响函数曲线峰值的变化在5%以内,证明了装配式混凝土华夫板方案的适用性。活载质量有利于楼盖对速度、加速度的控制,但不影响动刚度。采用单自由度体系推导的公式能够较准确地估算考虑活载后楼盖结构的位移、速度、加速度频响函数,可在工程中使用。Abstract: Based on an electronic chip factory project in Shanghai, an integrated prefabricated waffle slab system has been proposed. Using finite element modeling, the effects of joint depth and live load mass on the natural frequency, stiffness, and in-situ frequency response function of the floor slab were analyzed. The results showed that as the joint depth in the waffle slab increased, the natural frequency of the same order and the stiffness of the waffle slab decreased, while the vibration response of the floor increased. Moreover, the greater the joint depth, the more rapidly these indicators changed. When the joint depth was within 100 mm, the variations in the stiffness and peak frequency response function of the waffle slab remained within 5%, indicating the feasibility of the prefabricated concrete waffle slab system. The live load mass contributed to controlling the speed and acceleration responses of the floor but did not affect its dynamic stiffness. The formula derived from a single-degree-of-freedom system can accurately estimate the displacement, velocity, and acceleration frequency response functions of the floor structure under live loads and is recommended for practical engineering applications.
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Key words:
- chip plants /
- waffle slab /
- prefabricated /
- finite element method /
- frequency response function /
- dynamic stiffness
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