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Volume 55 Issue 12
Dec.  2025
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Article Contents
WU Jiewen, DING Jianguo, CHEN Yanbei, JIANG Min. Performance Analysis and Application of Dual-Control Vertical Isolators for Environmental Micro-Vibration[J]. INDUSTRIAL CONSTRUCTION, 2025, 55(12): 216-223. doi: 10.3724/j.gyjzG25091401
Citation: WU Jiewen, DING Jianguo, CHEN Yanbei, JIANG Min. Performance Analysis and Application of Dual-Control Vertical Isolators for Environmental Micro-Vibration[J]. INDUSTRIAL CONSTRUCTION, 2025, 55(12): 216-223. doi: 10.3724/j.gyjzG25091401

Performance Analysis and Application of Dual-Control Vertical Isolators for Environmental Micro-Vibration

doi: 10.3724/j.gyjzG25091401
  • Received Date: 2025-09-14
    Available Online: 2026-01-06
  • Publish Date: 2025-12-20
  • To address the dual requirements for environmental micro-vibration control and seismic protection in semiconductor factories, a dual-control isolation device for seismic and environmental micro-vibration was independently developed. A comprehensive research approach combining theoretical analysis, experimental validation, and numerical simulation was employed. The device features a layered design, incorporating vertical spring isolation elements with a natural frequency of 5 Hz and horizontal friction pendulum seismic elements embedded with shear pins. Scaled specimens were fabricated to conduct vertical compression tests, horizontal shear tests, and graded seismic tests on the shear pins, determining the key mechanical parameters and energy dissipation capacity under graded seismic actions. Using a semiconductor factory in Suzhou, Jiangsu Province as the engineering background, finite element models were established using ANSYS APDL, and the model reliability was validated through ABAQUS. The structural vibration responses were evaluated based on 1/3 octave analysis and BBN-VC standards. The results demonstrate that the device can achieve a three-level seismic fortification objective, with an acceleration isolation efficiency reaching 70% and a structural velocity amplitude reduction of 77% at 40 Hz, meeting the vibration sensitivity requirements of semiconductor manufacturing processes.
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