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Volume 53 Issue 9
Sep.  2023
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Article Contents
MENG Jiao, ZHOU Zhongyu, NIE Xin, ZHUANG Liangdong. Design and Mechanical Property Analysis of Prefabricated Steel-Concrete Composite Structure for Electronic Chip Plants[J]. INDUSTRIAL CONSTRUCTION, 2023, 53(9): 62-68. doi: 10.13204/j.gyjzG23081701
Citation: MENG Jiao, ZHOU Zhongyu, NIE Xin, ZHUANG Liangdong. Design and Mechanical Property Analysis of Prefabricated Steel-Concrete Composite Structure for Electronic Chip Plants[J]. INDUSTRIAL CONSTRUCTION, 2023, 53(9): 62-68. doi: 10.13204/j.gyjzG23081701

Design and Mechanical Property Analysis of Prefabricated Steel-Concrete Composite Structure for Electronic Chip Plants

doi: 10.13204/j.gyjzG23081701
  • Received Date: 2023-08-17
    Available Online: 2023-11-08
  • A prefabricated composite structure system composed of concrete-filled steel tubular columns, steel beams, and composite slabs without protruding rebars was proposed in response to the requirements and structural characteristics of electronic chip plants. Compared to traditional cast-in-place concrete structures, the new composite structure incurs a 33% increase in material costs but reduces the construction period by 28% and diminishes the template engineering quantity by 46%, resulting in substantial overall benefits. Moreover, a numerical analysis was conducted on the prefabricated composite frame structure and the traditional cast-in-place concrete structure. The prefabricated composite structure was observed to have better seismic resistance by decreasing the interlayer displacement angle under earthquake conditions while maintaining the same natural vibration characteristics and failure modes as the traditional structure. However, it is important to note that in comparison to the cast-in-place concrete structure system, the floor's natural vibration frequency using the prefabricated composite system decreased from 51.6 Hz to 30.1 Hz, and the vertical deflection under live load increased from 0.15 mm to 0.39 mm. Therefore, the applicability of the system for electronic workshops that are sensitive to micro-vibrations still needs to be further explored.
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